Fujimi Incorporated

Ebara Corporation

Hitoshi Morinaga

Kazusei Tamai

Maiko Asai

Keiji Ashitaka

Hiroshi Asano

Muneaki Tahara

Shuhei Takahashi

Yuuichi Ito

Tomohiro Imao

Toru Kamada

Kenya Ito

Jun Ito

Yu Ishii

Kohsuke Tsuchiya

Hiroaki Mizuno

Keigo Ohashi

Tomoaki Ishibashi

Shogaku Ide

Hiroyasu Sugiyama

Hiroyuki Ishida

Taizo Okajima

Kazutoshi Hotta

Akihito Yasui

Tsutomu Yamada

Eiichi Yamada

Kyohei Ota

Naoto Miyamoto

Youhei Takahashi

Kouichi Ootani

Yutaka Niwano

Takashi Horibe

Koji Katayama

Shingo Ohtsuki

Naoyuki Ishihara

Taira Otsu

Noboru Yasufuku

Shinji Furuta

Kyosuke Tenko

Yasushi Matsunami

A disc-shaped polishing pad () is used for a polishing method of the present invention. The polishing pad () has a peripheral surface () on a polishing surface () side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (). An angle formed by the peripheral surface () and the polishing surface () is 125&#xb0; or more and less than 180&#xb0;. The polishing pad () has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, 'Spring Hardness Test Type C Testing Method'. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (). The polishing surface () is pressed against the polished surface and the polishing pad () is moved to polish the polished surface.

Polishing method and polishing pad

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad () having an annular polishing surface () which has a curved vertical cross-section; a workpiece holder () for holding a workpiece (W) having a polygonal shape; a rotating device () configured to rotate the workpiece holder () about an axis of the workpiece (W); a pressing device () configured to press a periphery of the workpiece (W) against the annular polishing surface (); and an operation controller () configured to change a speed at which the rotating device () rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device () is disposed more inwardly than the workpiece holder () in a radial direction of the polishing table ().

Chemical mechanical polishing apparatus for polishing workpiece

Provided are an abrasive, a polishing composition, and a polishing method capable of polishing the surface of an alloy or metal oxide at a sufficient polishing removal rate and providing a high-quality mirror surface. The abrasive contains alumina having an &#x3b1;-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 &#x3bc;m or more to 0.35 &#x3bc;m or less. The polishing composition contains this abrasive and has a pH of 7 or less. These abrasive and polishing composition are used for polishing polishing objects containing at least one of an alloy and a metal oxide.

Abrasive, polishing composition, and polishing method

To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion () in which a plurality of fibers () having a length of 2 mm or more are raised on the surface of a base (), in which the mass of the fibers () is 250 g/mor more. The polishing pad is used for polishing an object to be polished () containing metal, an alloy, or a metal oxide material and having at least one of a projection portion () and a recessed portion () on the surface.

Polishing pad and polishing method

Provided are a sliding instrument having a low frictional resistance to the snow surface, the ice surface, or the water surface and having excellent sliding performance and a method for manufacturing the sliding instrument. A sliding instrument to slide on snow, ice, or water includes a sliding surface () to come into contact with the snow surface, the ice surface, or the water surface, and the sliding surface () has a surface roughness Ra of 1.0 &#x3bc;m or less. A method for manufacturing the sliding instrument includes polishing a sliding surface () using a polishing composition slurry containing abrasives to make the sliding surface () have a surface roughness Ra of 1.0 &#x3bc;m or less.

Sliding instrument and method for manufacturing same

Provided is an article having a novel surface with a texture different from conventional kinds. The article having a metal oxide-containing coating provided by the present invention comprises a substrate and a metal oxide-containing coating provided to the substrate surface. The metal oxide-containing coating has a Vickers hardness of 350 or higher, a surface roughness Ra of 300 nm or less, and a 20&#xb0; gloss value of 50 or higher.

Article comprising metal oxide-containing coating

A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.

Polishing tool and polishing method for member having curved surface shape

[Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. [Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect.

Polishing composition

Provided is a polishing composition which can polish a sapphire substrate having a non-polar plane or a semi-polar plane at a high polishing rate. The invention is a polishing composition used in an application to polish a sapphire substrate having a non-polar plane or a semi-polar plane, the polishing composition containing colloidal silica particles and water, in which a value obtained by dividing a specific surface area (unit: m/g) of the colloidal silica particles by a number average particle diameter (unit: nm) of the colloidal silica particles, that is, (specific surface area/number average particle diameter) is 0.5 or more and 3.0 or less.

A polishing composition contains colloidal silica. The colloidal silica satisfies the expression A&#xd7;D&#xd7;E&#xd7;F&#x2267;350,000 where 'A' denotes the average aspect ratio (dimensionless) of the colloidal silica, 'D' denotes the average particle diameter (units: nm) of the colloidal silica, &#x201c;E&#x201d; denotes the standard deviation of the particle size (units: nm) of the colloidal silica, and &#x201c;F&#x201d; denotes the volume fraction (units: %) of particles having a diameter of 1 to 300 nm in the colloidal silica. The volume fraction of particles having a diameter of 1 to 300 nm in the colloidal silica is 90% or greater.

A filtration method, that includes: (A) filtering a liquid having particles with a resin media filter; and (B) applying ultrasonic waves at a frequency of at least 30 kHz to the resin media filter during the filtering (A) or after completion of the filtering (A) to regenerate the resin media filter, where: i) a material of the resin media filter is nylon, polycarbonate, polytetrafluoroethylene (PTFE), polysulfone, polyether sulfone, and/or cellulose, ii) for the regeneration of the resin media filter, the applying results in a filter regeneration ratio of at least 0.40; iii) on a surface of the resin media filter, a support material comprising a mesh resin layer is disposed; and iv) the resin media filter is present in a filter housing having a three-dimensional shape and an ultrasonic vibrator, which generates the ultrasonic waves, is present on a lateral side of said filter housing.

Filtration method, method for purifying polishing composition using it, method for regenerating filter to be used for filtration, and filter regenerating apparatus

A polishing composition contains colloidal silica particles having protrusions on the surfaces thereof. The average of values respectively obtained by dividing the height of a protrusion on the surface of each particle belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles by the width of a base portion of the same protrusion is no less than 0.245. Preferably, the part of the colloidal silica particles that has larger particle diameter than the volume average particle diameter of the colloidal silica particles has an average aspect ratio of no less than 1.15. Preferably, the protrusions on the surfaces of particles belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles have an average height of no less than 3.5 nm.

A surface treatment composition of the present invention contains a first surfactant, a second surfactant, a basic compound, and water. The surface treatment composition has a pH of 8 or more. The second surfactant has a weight-average molecular weight one-half or less that of the first surfactant. The sum of the content of the first surfactant and the content of the second surfactant is 0.00001 to 0.1% by mass.

Surface treatment composition and surface treatment method using same

A polishing composition contains at least abrasive grains and water and is used in polishing an object to be polished. The abrasive grains are selected so as to satisfy the relationship X1&#xd7;Y1&#x2266;0 and the relationship X2&#xd7;Y2&#x3e;0, where X1 [mV] represents the zeta potential of the abrasive grains measured during polishing of the object by using the polishing composition, Y1 [mV] represents the zeta potential of the object measured during polishing of the object by using the polishing composition, X2 [mV] represents the zeta potential of the abrasive grains measured during washing of the object after polishing, and Y2 [mV] represents the zeta potential of the object measured during washing of the object after polishing. The abrasive grains are preferably of silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, silicon carbide, or diamond. The object is preferably of a nickel-containing alloy, silicon oxide, or aluminum oxide.

Polishing composition and polishing method using the same

To provide a wetting agent for semiconductors and a polishing composition whereby the wettability of a semiconductor substrate surface can be improved, and microdefects such as particle attachments can be remarkably reduced. A wetting agent for semiconductors, comprising a water soluble polymer compound having a low viscosity and water, and a polishing composition. A 0.3 wt % aqueous solution of the water soluble polymer compound has a viscosity of less than 10 mPa&#xb7;s at 25&#xb0; C.

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Kiyosu, Japan

Hitoshi Morinaga