The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Feb. 20, 2017
Applicant:

Fujimi Incorporated, Kiyosu, JP;

Inventors:

Toru Kamada, Aichi, JP;

Koji Katayama, Aichi, JP;

Hitoshi Morinaga, Aichi, JP;

Takashi Horibe, Aichi, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/22 (2012.01); B24B 29/00 (2006.01); B24B 37/24 (2012.01); B24D 13/14 (2006.01); B24B 19/26 (2006.01); B24B 29/02 (2006.01); B24B 37/26 (2012.01);
U.S. Cl.
CPC ...
B24B 37/22 (2013.01); B24B 19/26 (2013.01); B24B 29/00 (2013.01); B24B 29/02 (2013.01); B24B 37/24 (2013.01); B24B 37/245 (2013.01); B24B 37/26 (2013.01); B24D 13/14 (2013.01); B24D 13/142 (2013.01);
Abstract

A disc-shaped polishing pad () is used for a polishing method of the present invention. The polishing pad () has a peripheral surface () on a polishing surface () side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (). An angle formed by the peripheral surface () and the polishing surface () is 125° or more and less than 180°. The polishing pad () has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, 'Spring Hardness Test Type C Testing Method'. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (). The polishing surface () is pressed against the polished surface and the polishing pad () is moved to polish the polished surface.


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