Osaka, Japan

Hiroyuki Tanabe

USPTO Granted Patents = 34 

Average Co-Inventor Count = 2.4

ph-index = 3

Forward Citations = 25(Granted Patents)


Location History:

  • Ibaraki, JP (2018 - 2019)
  • Osaka, JP (2013 - 2021)

Company Filing History:


Years Active: 2013-2021

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34 patents (USPTO):Explore Patents

Title: **Hiroyuki Tanabe: A Pioneer in Wired Circuit Board Technology**

Introduction

Hiroyuki Tanabe, an accomplished inventor based in Osaka, Japan, has made significant contributions to the field of wired circuit board technology. With an impressive portfolio of 34 patented innovations, he stands out as a leading figure in his area of expertise.

Latest Patents

Hiroyuki Tanabe's latest patents include innovative methods for producing wired circuit boards. One such patent details a method that incorporates a stainless steel supporting layer with a stainless steel terminal. This process involves preparing the supporting layer with a passive film and subsequently forming a gold plating layer through a unique method that includes immersing the stainless steel layer in a specified gold plating solution while providing electrical current.

Another notable patent outlines a process for creating a wired circuit board that consists of an insulating layer and a conductive pattern. This method includes several precise steps: providing an inclination face on the insulating layer, applying a metal thin film, and utilizing a photoresist technique to form the desired conductive pattern while ensuring that light is effectively utilized in the process. These patents underscore Tanabe's innovative thinking and technical prowess.

Career Highlights

Hiroyuki Tanabe has dedicated his career to enhancing circuit board technologies. His role at Nitto-Denko Corporation allows him to spearhead various projects focused on advancing production methods in electronics. Tanabe's work is characterized by a commitment to improving both efficiency and functionality within the industry.

Collaborations

Throughout his career, Hiroyuki has collaborated with notable colleagues, including Yuu Sugimoto and Yoshito Fujimura. These partnerships have enabled him to refine his methods and contribute to groundbreaking patents that benefit the electronic manufacturing sector.

Conclusion

Hiroyuki Tanabe continues to be a pivotal figure in the innovation of wired circuit boards. His extensive knowledge, combined with his collaborative spirit, positions him as a leader who is shaping the future of electronic technologies. His inventions not only demonstrate technical ingenuity but also pave the way for advancements in efficient manufacturing processes within the electronics industry.

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