The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

May. 25, 2017
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Yuu Sugimoto, Osaka, JP;

Hiroyuki Tanabe, Osaka, JP;

Yoshito Fujimura, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 1/38 (2012.01); G03F 7/039 (2006.01); G03F 7/26 (2006.01); G03F 7/38 (2006.01); H05K 3/06 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
G03F 7/2022 (2013.01); G03F 1/38 (2013.01); G03F 7/039 (2013.01); G03F 7/2002 (2013.01); G03F 7/26 (2013.01); G03F 7/38 (2013.01); H05K 3/064 (2013.01); H05K 3/108 (2013.01); H05K 3/188 (2013.01); H05K 2203/0557 (2013.01);
Abstract

In a method for producing a wired circuit board includes a step (), in which the insulating layer having an inclination face is provided; a step (), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (), in which a photoresist is provided on the surface of the metal thin film; a step (), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (), in which the first light exposure portion and the second light exposure portion are removed; and a step (), in which the first wire and the second wire are provided on the surface of the metal thin film.


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