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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11091850 B1

PDFFull Text
Date of Patent:
Aug. 17, 2021

Filed:

Jan. 22, 2018

Producing method of wired circuit board

Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Yuu Sugimoto, Osaka, JP;

Hiroyuki Tanabe, Osaka, JP;

Assignee:

NITTO DENKO CORPORATION, Osaka, JP;

Attorneys:

Edwards Neils LLC

Jean C. Edwards, Esq.

Primary Examiner:

Louis J Rufo

Int. Cl.
CPC ...
C25D 5/02 (2006.01); H05K 1/05 (2006.01); C25D 7/00 (2006.01); C25D 3/48 (2006.01); C25D 5/50 (2006.01); H05K 3/24 (2006.01); C25D 5/10 (2006.01); C25D 5/36 (2006.01); H05K 3/18 (2006.01); H05K 3/46 (2006.01); G11B 5/48 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); C25D 3/48 (2013.01); C25D 5/022 (2013.01); C25D 5/10 (2013.01); C25D 5/36 (2013.01); C25D 5/50 (2013.01); C25D 7/00 (2013.01); H05K 1/05 (2013.01); H05K 3/188 (2013.01); H05K 3/241 (2013.01); H05K 3/243 (2013.01); H05K 3/4644 (2013.01); G11B 5/4833 (2013.01); H05K 1/0281 (2013.01); H05K 1/0393 (2013.01); H05K 1/053 (2013.01); H05K 1/056 (2013.01); H05K 1/11 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1476 (2013.01);
Abstract

A method for producing a wired circuit board including a stainless steel supporting layer having a stainless steel terminal includes a first step of preparing the stainless steel supporting layer having a passive film formed on the surface thereof and a second step of forming a first gold plating layer on the surface of the stainless steel terminal. In the second step, the stainless steel supporting layer is immersed in a first gold plating solution containing a weak acid and a gold compound without containing a strong acid, and electricity is supplied to the stainless steel supporting layer so that the passive film is removed and the first gold plating layer is formed on the surface of the stainless steel terminal.

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