The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Sep. 06, 2017
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Daisuke Yamauchi, Ibaraki, JP;

Hiroyuki Tanabe, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); G11B 5/48 (2006.01); H05K 3/40 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0224 (2013.01); G11B 5/484 (2013.01); G11B 5/486 (2013.01); H05K 1/0225 (2013.01); H05K 1/0228 (2013.01); H05K 1/056 (2013.01); H05K 1/115 (2013.01); H05K 3/4644 (2013.01); H05K 1/0245 (2013.01); H05K 1/0277 (2013.01); H05K 1/0393 (2013.01); H05K 1/053 (2013.01); H05K 1/09 (2013.01); H05K 3/4038 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/10083 (2013.01);
Abstract

In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.


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