The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Jul. 13, 2016
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Yuu Sugimoto, Ibaraki, JP;

Hiroyuki Tanabe, Ibaraki, JP;

Naohiro Terada, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01L 23/522 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/00 (2006.01); G01R 1/04 (2006.01); G11B 5/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0268 (2013.01); G01R 1/04 (2013.01); G11B 5/486 (2013.01); H05K 1/115 (2013.01); H05K 1/142 (2013.01); H05K 3/0097 (2013.01); H05K 3/424 (2013.01); H05K 2203/0165 (2013.01); H05K 2203/162 (2013.01);
Abstract

A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.


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