The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Dec. 21, 2016
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Yuu Sugimoto, Osaka, JP;
Hiroyuki Tanabe, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G11B 5/48 (2006.01); H05K 1/05 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); G11B 5/486 (2013.01); H05K 1/056 (2013.01); G11B 5/4853 (2013.01); H05K 1/0277 (2013.01); H05K 1/0393 (2013.01); H05K 3/108 (2013.01); H05K 2201/0191 (2013.01);
Abstract
The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.