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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10808329 B1

PDFFull Text
Date of Patent:
Oct. 20, 2020

Filed:

Jan. 22, 2018

Wired circuit board and production method thereof

Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Yuu Sugimoto, Osaka, JP;

Hiroyuki Tanabe, Osaka, JP;

Assignee:

NITTO DENKO CORPORATION, Osaka, JP;

Attorneys:

Jean C. Edwards, Esq.

Edwards Neils LLC

Primary Examiner:

Ishwarbhai B Patel

Int. Cl.
CPC ...
H05K 1/05 (2006.01); G11B 5/48 (2006.01); C25D 5/02 (2006.01); C25D 7/00 (2006.01); C25D 3/48 (2006.01); C25D 5/50 (2006.01); H05K 3/24 (2006.01); C25D 5/10 (2006.01); C25D 5/36 (2006.01); H05K 3/18 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); C25D 3/48 (2013.01); C25D 5/022 (2013.01); C25D 5/10 (2013.01); C25D 5/36 (2013.01); C25D 5/50 (2013.01); C25D 7/00 (2013.01); H05K 1/05 (2013.01); H05K 3/188 (2013.01); H05K 3/241 (2013.01); H05K 3/243 (2013.01); H05K 3/4644 (2013.01); G11B 5/4833 (2013.01); H05K 1/0281 (2013.01); H05K 1/0393 (2013.01); H05K 1/053 (2013.01); H05K 1/056 (2013.01); H05K 1/11 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1476 (2013.01);
Abstract

The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.

Find Patent Forward Citations

Sugimoto, Yuu. (2020). Wired circuit board and production method thereof (U.S. Patent No. 10808329). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10808329

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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