This inventor holds 7 USPTO granted patents and 3 EPO patents. Top assignees: Shipley Company LLC, Rohm & Haas Electronic Materials LLC. Active years: 2004-2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004-2008
Title: Innovator Hideki Tsuchida: Pioneering Advances in Copper Plating Technologies
Introduction
Hideki Tsuchida, based in Hasuda, Japan, is a prominent inventor with a remarkable portfolio comprising seven patents. His innovative contributions primarily focus on advanced plating methods that have significant implications in the electronics industry.
Latest Patents
Among his latest patents, Tsuchida has developed a unique plating method involving copper plating baths that contain a leveling agent, which is a reaction product of a compound featuring heteroatoms such as nitrogen and sulfur. This innovation facilitates the deposition of a copper layer on electronic devices, achieving a substantially planar surface across various electrolyte concentrations. Additionally, he has devised an electrolytic copper plating method using a solution that includes a specific compound structure, which is enhanced by incorporating ozone during the plating process. These inventions showcase his commitment to enhancing the efficiency and effectiveness of copper deposition techniques.
Career Highlights
Throughout his career, Hideki Tsuchida has worked with leading companies in the electronics materials sector, such as Shipley Company LLC and Rohm and Haas Electronic Materials LLC. His work at these organizations has allowed him to refine his expertise and contribute to technological advancements in copper plating.
Collaborations
Tsukida has collaborated with notable individuals, including Shinjiro Hayashi and Masaru Kusaka, who have played a significant role in his research endeavors. Their joint efforts highlight the collaborative nature of innovation in the field of plating technologies.
Conclusion
Hideki Tsuchida's work exemplifies the pursuit of innovation in the field of electronic materials. His groundbreaking patents reflect a deep understanding of plating methods and their application in modern technology. As the electronics industry continues to evolve, his contributions will undoubtedly play a pivotal role in shaping the future of copper plating techniques.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile