The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Dec. 20, 2002
Applicant:
Inventors:
Masaru Kusaka, Saitama, JP;
Hideki Tsuchida, Hasuda, JP;
Assignee:
Shipley Company, L.L.C., Marlborough, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 ; C25D 5/18 ;
U.S. Cl.
CPC ...
C25D 5/02 ; C25D 5/18 ;
Abstract
A via filling method that provides superior filling properties and superior planarization of the deposited metal layer is provided. This is achieved by a method having a F/R ratio, the ratio of the electric current densities between the forward electrolysis and the reverse electrolysis, is in the range of 1/1 to 1/10 in a PPR electric current method applied with a cycle wherein the forward electrolysis interval is from 1 to 50 msec and the reverse electrolysis interval is from 0.2 to 5 msec.
Kusaka, Masaru. (2004). Via filling method (U.S. Patent No. 6761814). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6761814
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile