The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2004
Filed:
Aug. 21, 2002
Applicant:
Inventors:
Masaru Seita, Kitaadachi-gun, JP;
Hideki Tsuchida, Hasuda, JP;
Masaaki Imanari, Misato, JP;
Yoshihiro Sugita, Kitaadachi-gun, JP;
Assignee:
Shipley Company, L.L.C., Marlborough, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 1/508 ; C23C 2/802 ; C25D 5/02 ; C25D 5/56 ;
U.S. Cl.
CPC ...
B32B 1/508 ; C23C 2/802 ; C25D 5/02 ; C25D 5/56 ;
Abstract
A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.
Seita, Masaru. (2004). Method for manufacturing copper-resin composite material (U.S. Patent No. 6740425). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6740425
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile