The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2004

Filed:

Jun. 07, 2002
Applicant:
Inventors:

Hideki Tsuchida, Hasuda, JP;

Masaru Kusaka, Saitama, JP;

Shinjiro Hayashi, Saitama, JP;

Assignee:

Shipley Company, L.L.C., Marlborough, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 2/106 ; C25D 2/118 ; C25D 3/38 ; C25D 5/02 ; H01L 2/1288 ;
U.S. Cl.
CPC ...
C25D 2/106 ; C25D 2/118 ; C25D 3/38 ; C25D 5/02 ; H01L 2/1288 ;
Abstract

Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The method described above can maintain and restore the electrolytic copper plating solution so as to maintain satisfactory appearance of plated copper, fineness of deposited copper film, and via-filling.


Find Patent Forward Citations

Loading…