Location History:
- Saitama, JP (2004 - 2010)
- Niigata, JP (2015 - 2020)
Company Filing History:
Years Active: 2004-2020
Title: The Innovative Contributions of Shinjiro Hayashi
Introduction
Shinjiro Hayashi is a prominent inventor based in Saitama, Japan. He has made significant contributions to the field of electroless plating and copper electroplating solutions. With a total of 11 patents to his name, Hayashi's work has had a considerable impact on the materials science industry.
Latest Patents
One of Hayashi's latest patents is a catalyst solution for electroless plating. This invention relates to a stable palladium ion catalyst aqueous solution that does not use boric acid and can be used stably over a wide pH range. The catalyst solution contains palladium ion, a palladium ion complexing agent, and a specific amine compound, making it alkaline. Another notable patent is for a copper electroplating solution and method. This copper plating solution contains compounds with a specific structure that allows for the formation of good filled vias without worsening the appearance of the plating.
Career Highlights
Throughout his career, Shinjiro Hayashi has worked with notable companies such as Rohm & Haas Electronic Materials LLC and Shipley Company, LLC. His experience in these organizations has contributed to his expertise in the field of electroplating and materials science.
Collaborations
Hayashi has collaborated with several professionals in his field, including Hideki Tsuchida and Makoto Sakai. These collaborations have likely enhanced his innovative capabilities and contributed to his successful patent applications.
Conclusion
Shinjiro Hayashi's contributions to the field of electroless plating and copper electroplating solutions demonstrate his innovative spirit and expertise. His patents reflect a commitment to advancing technology in materials science.