The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Dec. 27, 2012
Applicant:
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Inventors:
Mutsuko Saito, Niigata, JP;
Makoto Sakai, Niigata, JP;
Toshiyuki Morinaga, Niigata, JP;
Shinjiro Hayashi, Niigata, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); H01L 21/768 (2006.01); H01L 21/288 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); H01L 21/2885 (2013.01); H01L 21/76898 (2013.01); H05K 3/424 (2013.01);
Abstract
A copper electroplating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. By using this copper electroplating solution, it is possible to form good filled vias without worsening the appearance of the plating.