This inventor holds 3 USPTO granted patents and 2 published patent applications and 5 EPO patents. Top assignee: Rohm & Haas Electronic Materials LLC. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Mutsuko Saito - Innovator in Electrolytic Plating Solutions
Introduction
Mutsuko Saito is a notable inventor based in Niigata-shi, Japan. She has made significant contributions to the field of electrolytic plating solutions. Although she currently holds no granted patents, her innovative ideas are reflected in her latest patent applications.
Latest Patent Applications
Mutsuko Saito's recent patent applications include two noteworthy solutions. The first is an electrolytic copper plating solution designed to form a rectangular circuit pattern. This application describes a method for conducting electrolytic plating on a board using the solution, which contains two specific surfactants. The second application is for a tin plating solution aimed at achieving uniformity in through-hole plating and film thickness distribution. This solution includes a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate, and 1,10-phenanthroline.
Conclusion
Mutsuko Saito's work in electrolytic plating solutions showcases her innovative spirit and dedication to advancing technology in this field. Her latest patent applications highlight her potential to contribute significantly to the industry in the future.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile