The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
Jul. 07, 2006
Shinjiro Hayashi, Saitama, JP;
Hideki Tsuchida, Hasuda, JP;
Masaru Kusaka, Saitama, JP;
Koichi Yomogida, Saitama, JP;
Shinjiro Hayashi, Saitama, JP;
Hideki Tsuchida, Hasuda, JP;
Masaru Kusaka, Saitama, JP;
Koichi Yomogida, Saitama, JP;
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Abstract
Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. Such plating baths deposit a copper layer on the substrate surface that is substantially planar across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.