The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2005
Filed:
Nov. 26, 2003
Applicants:
Hideki Tsuchida, Hasuda, JP;
Masaru Kusaka, Saitama, JP;
Shinjiro Hayashi, Saitama, JP;
Inventors:
Assignee:
Shipley Company, L.L.C., Marlborough, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D021/16 ; C25D021/18 ; C25D003/38 ; B01D017/06 ;
U.S. Cl.
CPC ...
Abstract
A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and X and Y may be the same only when they are a carbon atom, and by contacting the electrolytic copper plating solution with ozone is disclosed.