The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Dec. 24, 2012
Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Matsuko Saito, Niigata, JP;

Makoto Sakai, Niigata, JP;

Shinjiro Hayashi, Niigata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/40 (2006.01); C25D 5/02 (2006.01); H01L 21/288 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01);
Abstract

A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.


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