Niigata, Japan

Matsuko Saito

This inventor holds 1 USPTO granted patent. Top assignee: Rohm & Haas Electronic Materials LLC. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Matsuko Saito. Retrieved from https://idiyas.com/inventor/matsuko-saito

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Matsuko Saito: Innovator in Copper Electroplating Solutions

Introduction

Matsuko Saito is a prominent inventor based in Niigata, Japan. She has made significant contributions to the field of electroplating, particularly with her innovative copper electroplating solution. Her work has implications for various industries, including electronics and materials science.

Latest Patents

Matsuko Saito holds a patent for a copper electroplating solution and method of copper electroplating. This solution contains compounds with the structure —X—S—Y—, where X and Y are atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen. Notably, X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. The use of this copper electroplating solution allows for the formation of well-filled vias without compromising the appearance of the plating.

Career Highlights

Matsuko Saito is currently employed at Rohm & Haas Electronic Materials LLC, where she continues to develop innovative solutions in the field of electroplating. Her expertise and dedication have positioned her as a key figure in her organization.

Collaborations

Matsuko has collaborated with notable colleagues, including Makoto Sakai and Shinjiro Hayashi. These partnerships have fostered a collaborative environment that enhances innovation and research in their field.

Conclusion

Matsuko Saito's contributions to copper electroplating technology exemplify her innovative spirit and commitment to advancing materials science. Her work not only enhances the quality of electroplating processes but also sets a standard for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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