The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Nov. 01, 2002
Masaru Seita, Saitama, JP;
Hideki Tsuchida, Hasuda, JP;
Masaaki Imanari, Misato, JP;
Koichi Yomogida, Saitama, JP;
Hidemi Nawafune, Takatsuki, JP;
Masaru Seita, Saitama, JP;
Hideki Tsuchida, Hasuda, JP;
Masaaki Imanari, Misato, JP;
Koichi Yomogida, Saitama, JP;
Hidemi Nawafune, Takatsuki, JP;
Shipley Company, L.L.C., Marlborough, MA (US);
Abstract
This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 μm or less, can be prepared that is otherwise difficult to prepare using conventional methods.