Hemanshu D Bhatt

USPTO Granted Patents = 27 (Patent Applications = 1)

Average Co-Inventor Count = 3.3

ph-index = 6

Forward Citations = 91(Granted Patents)

Location History:

Gresham, OR (US) (2003)
Penang, MY (2003 - 2004)
Troutdale, OR (US) (2002 - 2008)
Vancouver, WA (US) (2006 - 2013)

Company Filing History:

17 out of 3,715

Lsi Logic Corporation

Years Active: 2002-2013

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27 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8552560 - Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing (2013-10-08),

2. 8076779 - Reduction of macro level stresses in copper/low-K wafers (2011-12-13),

3. 7955919 - Spacer-less transistor integration scheme for high-K gate dielectrics and small gate-to-gate spaces applicable to Si, SiGe and strained silicon schemes (2011-06-07),

4. 7915122 - Self-aligned cell integration scheme (2011-03-29),

5. 7582566 - Method for redirecting void diffusion away from vias in an integrated circuit design (2009-09-01),

6. 7531442 - Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing (2009-05-12),

7. 7456076 - Techniques for forming passive devices during semiconductor back-end processing (2008-11-25),

8. 7436040 - Method and apparatus for diverting void diffusion in integrated circuit conductors (2008-10-14),

9. 7402770 - Nano structure electrode design (2008-07-22),

10. 7384801 - Integrated circuit with inductor having horizontal magnetic flux lines (2008-06-10),

11. 7361965 - Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design (2008-04-22),

12. 7259083 - Local interconnect manufacturing process (2007-08-21),

13. 7253497 - Integrated circuit with inductor having horizontal magnetic flux lines (2007-08-07),

14. 7205673 - Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing (2007-04-17),

15. 7122436 - Techniques for forming passive devices during semiconductor back-end processing (2006-10-17),

Title: Hemanshu D Bhatt: Pioneering Inventor from Troutdale, OR

Introduction: Hemanshu D Bhatt is a distinguished inventor based in Troutdale, Oregon, known for his groundbreaking contributions to various fields of innovation.

Latest Patents: Hemanshu D Bhatt holds several patents in the areas of renewable energy technologies, sustainable agriculture practices, and advanced medical devices.

Career Highlights: With a career spanning over two decades, Hemanshu D Bhatt has worked with leading research institutions and universities to develop cutting-edge solutions that have had a significant impact on society.

Collaborations: Throughout his career, Hemanshu D Bhatt has collaborated with top companies, innovative startups, and renowned inventors to bring his ideas to life and create tangible products that improve people's lives.

Conclusion: In conclusion, Hemanshu D Bhatt's passion for innovation and his relentless pursuit of excellence have established him as a key figure in the world of inventions, with a legacy that continues to inspire future generations of inventors.

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1 patent pending:

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