The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2013

Filed:

Nov. 18, 2005
Applicants:

Hemanshu Bhatt, Vancouver, WA (US);

Dilip Vijay, Redwood City, CA (US);

Jayanthi Pallinti, Santa Clara, CA (US);

Sey-shing Sun, Portland, OR (US);

Hong Ying, Cupertino, CA (US);

Chiyi Kao, San Jose, CA (US);

Inventors:

Hemanshu Bhatt, Vancouver, WA (US);

Dilip Vijay, Redwood City, CA (US);

Jayanthi Pallinti, Santa Clara, CA (US);

Sey-Shing Sun, Portland, OR (US);

Hong Ying, Cupertino, CA (US);

Chiyi Kao, San Jose, CA (US);

Assignee:

LSI Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
Abstract

Passivation integration schemes and pad structures to reduce the stress gradients and/or improve the contact surface existing between the Al in the pad and the gold wire bond. One of the pad structures provides a plurality of recessed pad areas which are formed in a single aluminum pad. An oxide mesa can be provided under the aluminum pad. Another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a copper pad and a plurality of trench/via pads. Still another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a portion of a copper pad, such that the aluminum pad and the copper pad are staggered relative to each other.


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