Company Filing History:

3 out of 2,353

Lsi Corporation

patents

1 out of 3,715

Lsi Logic Corporation

patents

Years Active: 2007-2013

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8552560 - Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing (2013-10-08),

2. 8076779 - Reduction of macro level stresses in copper/low-K wafers (2011-12-13),

3. 7531442 - Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing (2009-05-12),

4. 7205673 - Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing (2007-04-17),

Title: The Innovative Journey of Chiyi Kao

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Latest Patents: Chiyi Kao's latest patents focus on advancements in artificial intelligence algorithms for autonomous vehicles, revolutionizing the way we approach transportation technology.

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Conclusion: Chiyi Kao's relentless pursuit of innovation and his passion for pushing the limits of technology make him a true visionary in the field of inventing.

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