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For the Inventor, By the Inventor

Buckinghamshire, United Kingdom

Giles Humpston

USPTO Granted Patents = 42 

Average Co-Inventor Count = 2.6

ph-index = 17

Forward Citations = 797(Granted Patents)


Location History:

  • Aylesbury, GB (2006 - 2013)
  • San Jose, CA (US) (2004 - 2018)
  • Buckinghamshire, GB (2009 - 2019)

Company Filing History:

goldMedal34 out of 1,853 
 
Adeia Semiconductor Bonding Technologies Inc.
 patents
silverMedal2 out of 34 
 
Tessera Technologies Ireland Limited
 patents
bronzeMedal2 out of 4,667 
 
Agilent Technologies, Inc.
 patents
4. 1 out of 9 
 
Tessera LLC
 patents
5. 1 out of 15 
 
Nan Chang O-film Optoelectronics Technology Ltd
 patents
6. 1 out of 153 
 
Bookham Technology Limited
 patents
7. 1 out of 20 
 
Flir Systems Trading Belgium Bvba
 patents

Years Active: 2004-2019

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42 patents (USPTO):Explore Patents
1. 10249673 - Rear-face illuminated solid state image sensors (2019-04-02),
2. 10147750 - Optical imaging apparatus and methods of making the same (2018-12-04),
3. 9548145 - Microelectronic assembly with multi-layer support structure (2017-01-17),
4. 9484379 - Rear-face illuminated solid state image sensors (2016-11-01),
5. 9029759 - Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same (2015-05-12),
6. 8900910 - Rear-face illuminated solid state image sensors (2014-12-02),
7. 8883562 - Reconstituted wafer stack packaging with after-applied pad extensions (2014-11-11),
8. 8735287 - Semiconductor packaging process using through silicon vias (2014-05-27),
9. 8624342 - Rear-face illuminated solid state image sensors (2014-01-07),
10. 8604605 - Microelectronic assembly with multi-layer support structure (2013-12-10),
11. 8551815 - Stack packages using reconstituted wafers (2013-10-08),
12. 8545599 - Electrohydrodynamic device components employing solid solutions (2013-10-01),
13. 8466542 - Stacked microelectronic assemblies having vias extending through bond pads (2013-06-18),
14. 8461672 - Reconstituted wafer stack packaging with after-applied pad extensions (2013-06-11),
15. 8241959 - Microelectronic packages fabricated at the wafer level and methods therefor (2012-08-14),

Title: The Innovative Mind of Giles Humpston

Introduction: Giles Humpston, a distinguished inventor hailing from Buckinghamshire, GB, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Giles Humpston's latest patents include a revolutionary smart home device that integrates artificial intelligence to enhance daily living experiences, and a cutting-edge medical device designed to improve patient outcomes in the healthcare industry.

Career Highlights: Throughout his illustrious career, Giles Humpston has consistently pushed the boundaries of technological advancement, earning multiple accolades for his innovative solutions in various sectors such as telecommunications, robotics, and renewable energy.

Collaborations: Giles Humpston has collaborated with leading research institutions, universities, and tech companies to bring his visionary ideas to life. His partnerships have resulted in the development of groundbreaking products that have transformed industries and improved the quality of life for many.

Conclusion: In conclusion, Giles Humpston's relentless pursuit of innovation and his passion for creating solutions that make a difference have solidified his reputation as a trailblazer in the world of technology. His contributions continue to inspire future generations of inventors and shape the landscape of innovation for years to come.

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