The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Dec. 04, 2013
Applicant:
Invensas Corporation, San Jose, CA (US);
Inventors:
Michael J. Nystrom, San Jose, CA (US);
Giles Humpston, Buckinghamshire, GB;
Assignee:
Invensas Corporation, San Jose, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
H01B 13/00 (2013.01); H01L 23/10 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48463 (2013.01); Y10T 29/49126 (2015.01); Y10T 156/1062 (2015.01); Y10T 156/1092 (2015.01);
Abstract
A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.