The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Apr. 12, 2012
Applicants:

Harpuneet Singh, Dublin, CA (US);

Giles Humpston, Buckinghamshire, GB;

Ellis Chau, San Jose, CA (US);

Eddie Azuma, San Jose, CA (US);

Peter Pietrangelo, San Jose, CA (US);

Ocie Ward, Petaluma, CA (US);

Inventors:

Harpuneet Singh, Dublin, CA (US);

Giles Humpston, Buckinghamshire, GB;

Ellis Chau, San Jose, CA (US);

Eddie Azuma, San Jose, CA (US);

Peter Pietrangelo, San Jose, CA (US);

Ocie Ward, Petaluma, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 5/02 (2006.01); H01L 31/0232 (2014.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01); H04N 5/2257 (2013.01);
Abstract

A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.


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