The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Jun. 06, 2013
Applicant:

Tessera, Inc., San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Giles Humpston, Buckinghamshire, GB;

David Ovrutsky, San Jose, CA (US);

Laura Wills Mirkarimi, Sunol, CA (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 2924/01075 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06524 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/014 (2013.01); H01L 24/96 (2013.01); H01L 25/0657 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01005 (2013.01); H01L 25/0652 (2013.01); H01L 2924/01033 (2013.01); H01L 2225/06551 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01006 (2013.01); H01L 25/50 (2013.01);
Abstract

A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements each having a front surface, contacts exposed at the front surface, a rear surface and edges extending between the front and rear surfaces. Traces connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face of the microelectronic unit. A plurality of conductors may extend along edges of the microelectronic elements from the traces to the top face. The conductors may be conductively connected with unit contacts such that the unit contacts overlie the rear surface of the at least one microelectronic element adjacent to the top face.


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