Adeia Semiconductor Bonding Technologies Inc.

Agilent Technologies, Inc.

Tessera Technologies Ireland Limited

Bookham Technology Limited

Flir Systems Trading Belgium Bvba

Nan Chang O-film Optoelectronics Technology Ltd

Tessera LLC

Giles Humpston

Belgacem Haba

Michael James Nystrom

David Bazeley Tuckerman

Moshe Kriman

Richard Dewitt Crisp

David Ovrutsky

Osher Avsian

Masud Beroz

Moti Margalit

Vage Oganesian

Laura Wills Mirkarimi

Gary Richard Trott

Yoshikatsu Ichimura

Kenneth Allen Honer

Jesse B Thompson

Daniel J Miller

Andrey Grinman

Charles Rosenstein

Felix Hazanovich

Nancy M Mar

Robert Burtzlaff

Craig S Mitchell

Guilian Gao

William Hudson Welch

Ellis Chau

Michael Warner

Harpuneet Singh

Jae M Park

Stuart E Wilson

Ronald Patrick Green

Christopher Wade

Nicholas J Colella

Ocie Ward

Eddie Azuma

Bruce M McWilliams

Heidi Linch Reynolds

Avi Dayan

Ilya Hecht

Peter Pietrangelo

Yulia Aksenton

Mitchell Hayes Reifel

Anthony Patrick Needham

Anthony John Salloway

Dmitri Burshtyn

Ekaterina Axelrod

A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

Rear-face illuminated solid state image sensors

The present invention provides optical imaging apparatus comprising solid state sensing elements and optical components operable to be manufactured and assembled at the wafer level.

Optical imaging apparatus and methods of making the same

A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Microelectronic assembly with multi-layer support structure

A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same

A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements each having a front surface, contacts exposed at the front surface, a rear surface and edges extending between the front and rear surfaces. Traces connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face of the microelectronic unit. A plurality of conductors may extend along edges of the microelectronic elements from the traces to the top face. The conductors may be conductively connected with unit contacts such that the unit contacts overlie the rear surface of the at least one microelectronic element adjacent to the top face.

Reconstituted wafer stack packaging with after-applied pad extensions

A microelectronic unit can include a semiconductor element having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts at the front surface and a rear surface remote from the front surface. The semiconductor element can have through holes extending from the rear surface through the semiconductor element and through the contacts. A dielectric layer can line the through holes. A conductive layer may overlie the dielectric layer within the through holes. The conductive layer can conductively interconnect the contacts with unit contacts.

Semiconductor packaging process using through silicon vias

A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.

Stack packages using reconstituted wafers

A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. One of the electrodes includes a solid solution formed of a solvent metal having a first performance characteristic and a solute material having a second performance characteristic. The first and second performance characteristics are exhibited substantially independently in the electrode as the solvent metal and solute material remain substantially pure within the solid solution. A method of making an EHD product includes providing an electrode with such a solid solution and positioning the electrode relative to another electrode to motivate fluid flow when energized.

Electrohydrodynamic device components employing solid solutions

A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.

Stacked microelectronic assemblies having vias extending through bond pads

A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (A) each having a front surface (), contacts () exposed at the front surface, a rear surface () and edges () extending between the front and rear surfaces. Traces () connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face () of the microelectronic unit. A plurality of conductors () may extend along edges of the microelectronic elements from the traces () to the top face (). The conductors may be conductively connected with unit contacts () such that the unit contacts overlie the rear surface () of the at least one microelectronic element (A) adjacent to the top face.

A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

Microelectronic packages fabricated at the wafer level and methods therefor

Growing community of inventors

Buckinghamshire, United Kingdom

Giles Humpston