The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2013
Filed:
Mar. 12, 2010
Moshe Kriman, Charlotte, NC (US);
Osher Avsian, Huntersville, NC (US);
Belgacem Haba, Saratoga, CA (US);
Giles Humpston, Buckinghamshire, GB;
Dmitri Burshtyn, Jerusalem, IL;
Moshe Kriman, Charlotte, NC (US);
Osher Avsian, Huntersville, NC (US);
Belgacem Haba, Saratoga, CA (US);
Giles Humpston, Buckinghamshire, GB;
Dmitri Burshtyn, Jerusalem, IL;
Tessera, Inc., San Jose, CA (US);
Abstract
A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.