Location History:
- Kiryat Ono, IL (2011)
- Huntersville, NC (US) (2013 - 2018)
Company Filing History:
Years Active: 2011-2018
Title: Innovator Spotlight: Osher Avsian from Huntersville, NC
Introduction: Osher Avsian is a prominent inventor based in Huntersville, North Carolina, who has made significant contributions to the field of optical imaging and microelectronics. With a total of four patents to his name, his innovations showcase a blend of advanced technology and practical applications.
Latest Patents: One of Avsian's latest patents is for an "Optical imaging apparatus and methods of making the same." This invention presents an optical imaging apparatus that comprises solid-state sensing elements and optical components that can be manufactured and assembled at the wafer level. Another notable patent is the "Stack packages using reconstituted wafers," which details a stacked microelectronic unit with multiple vertically stacked elements. This unit features essential design elements that enhance microelectronic functionality, including dielectric layers and unit contacts that are connected for optimal performance.
Career Highlights: Throughout his career, Osher Avsian has worked with esteemed companies, including Adeia Semiconductor and Bonding Technologies Inc. and Tessera Technologies Ireland Limited. His experience in these organizations has allowed him to push the boundaries of innovation in microelectronics and optical imaging technologies.
Collaborations: Avsian has collaborated with notable peers, including Giles Humpston and Andrey Grinman. Their joint efforts in the field of technology showcase the collaborative spirit essential for advancing innovations in the electronics industry.
Conclusion: Osher Avsian stands out as a significant innovator in the realms of optical imaging and microelectronics. With his remarkable patents and collaborations, he continues to influence the landscape of technology and inspire future innovations. His work exemplifies how creativity and technical skill can lead to groundbreaking advancements in our understanding and utilization of electronic materials.