The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2011
Filed:
Jan. 19, 2007
Giles Humpston, Aylesbury, GB;
Michael J. Nystrom, San Jose, CA (US);
Vage Oganesian, Palo Alto, CA (US);
Yulia Aksenton, Jerusalem, IL;
Osher Avsian, Kiryat Ono, IL;
Robert Burtzlaff, San Jose, CA (US);
Avi Dayan, Jerusalem, IL;
Andrey Grinman, Jerusalem, IL;
Felix Hazanovich, Jerusalem, IL;
Ilya Hecht, Beit Shemesh, IL;
Charles Rosenstein, Ramat Beit Shemesh, IL;
David Ovrutsky, Ashkelon, IL;
Mitchell Hayes Reifel, San Jose, CA (US);
Giles Humpston, Aylesbury, GB;
Michael J. Nystrom, San Jose, CA (US);
Vage Oganesian, Palo Alto, CA (US);
Yulia Aksenton, Jerusalem, IL;
Osher Avsian, Kiryat Ono, IL;
Robert Burtzlaff, San Jose, CA (US);
Avi Dayan, Jerusalem, IL;
Andrey Grinman, Jerusalem, IL;
Felix Hazanovich, Jerusalem, IL;
Ilya Hecht, Beit Shemesh, IL;
Charles Rosenstein, Ramat Beit Shemesh, IL;
David Ovrutsky, Ashkelon, IL;
Mitchell Hayes Reifel, San Jose, CA (US);
Abstract
Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.