Beit Shemesh, Israel

Ilya Hecht


Average Co-Inventor Count = 9.9

ph-index = 2

Forward Citations = 109(Granted Patents)


Company Filing History:


Years Active: 2010-2011

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2 patents (USPTO):Explore Patents

Title: Ilya Hecht: Innovator in Microelectronic Packaging

Introduction

Ilya Hecht, based in Beit Shemesh, Israel, is a prominent inventor known for his contributions in the field of microelectronics. With a total of two patents, Hecht has made significant advancements that pave the way for innovative applications in technology.

Latest Patents

Ilya Hecht's latest patents focus on wafer-level chip packaging and wafer-level fabrication of lidded chips. His first patent, titled "Wafer level chip packaging," involves a unique method for packaging microelectronic elements. This patent highlights a microelectronic element with a distinct front face and a device region, alongside a contact region featuring exposed contacts. The design includes support walls that allow for the secure mounting of a lid, which can feature exposed contacts beyond its edges.

His second patent, related to "Wafer-level fabrication of lidded chips with electrodeposited dielectric coating," describes a sophisticated method for creating semiconductor units, such as those used in optical imaging. This invention involves forming an insulative layer via electrodeposition, which covers exposed conductive materials, while ensuring connectivity through conductive contacts and traces, ultimately integrating with a camera module.

Career Highlights

Throughout his career, Ilya Hecht has contributed to significant technological advancements while working with leading companies. He has been associated with Tessera Technologies Hungary Kft. and Tessera Technologies Ireland Limited, where he played a critical role in innovating microelectronic packaging solutions.

Collaborations

Ilya has collaborated with notable professionals, including Vage Oganesian and Andrey Grinman. Their teamwork has fostered an environment of innovation, leading to breakthroughs in microelectronic design and fabrication techniques.

Conclusion

Ilya Hecht represents a remarkable figure in the realm of microelectronics, with a focus on advanced packaging solutions. His patents not only exemplify ingenuity but also provide foundational technologies for future advancements in the field. As technology continues to evolve, the contributions made by inventors like Ilya Hecht will undoubtedly shape its trajectory.

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