Company Filing History:
7 out of 1,857 
2 out of 34 
1 out of 11 Years Active: 2010-2017
Title: The Innovations of Charles Rosenstein
Introduction
Charles Rosenstein is a prominent inventor based in Ramat Beit Shemesh, Israel. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work has been instrumental in advancing the capabilities of packaged semiconductor chips.
Latest Patents
Among his latest innovations is a patented design for packaged semiconductor chips with an array. This chip-sized, wafer-level packaged device includes a portion of a semiconductor wafer containing a device. It features at least one packaging layer made of silicon, formed over the device. Additionally, it incorporates a first ball grid array that is electrically connected to the device and a second ball grid array formed over the surface of the semiconductor wafer, also connected to the device.
Career Highlights
Throughout his career, Charles has worked with notable companies in the semiconductor industry. He has been associated with Adeia Semiconductor Bonding Technologies Inc. and Tessera Technologies Ireland Limited. His expertise in semiconductor packaging has made him a valuable asset in these organizations.
Collaborations
Charles has collaborated with several professionals in his field, including David Ovrutsky and Vage Oganesian. These partnerships have contributed to the development of innovative technologies in semiconductor packaging.
Conclusion
Charles Rosenstein's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence advancements in the field of electronics.