Yulia Aksenton

Title: Yulia Aksenton: Innovator in Microelectronic Packaging

Introduction

Yulia Aksenton is a prominent inventor based in Jerusalem, Israel. She has made significant contributions to the field of microelectronics, particularly in the area of chip packaging. With a total of two patents to her name, Aksenton's work showcases her innovative approach to enhancing microelectronic elements.

Latest Patents

Aksenton's latest patents include advancements in wafer-level chip packaging. This innovation involves packaged microelectronic elements that feature a front face and multiple peripheral edges. The design includes a device region and a contact region with exposed contacts, allowing for efficient integration and functionality. Additionally, her patent on wafer-level fabrication of lidded chips with electrodeposited dielectric coating outlines a method for creating semiconductor units, such as sensor units for optical imaging. This method ensures that conductive features are insulated while maintaining connectivity through conductive contacts and traces.

Career Highlights

Throughout her career, Aksenton has worked with notable companies, including Tessera Technologies Hungary and Tessera Technologies Ireland. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking projects in microelectronics.

Collaborations

Aksenton has collaborated with talented professionals in her field, including Vage Oganesian and Andrey Grinman. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Yulia Aksenton's contributions to microelectronic packaging and fabrication highlight her role as a leading inventor in the industry. Her patents reflect a commitment to advancing technology and improving the functionality of microelectronic devices.