Robert Burtzlaff

Title: Robert Burtzlaff - Innovator in Microelectronic Packaging

Introduction

Robert Burtzlaff is a notable inventor based in San Jose, California, recognized for his significant contributions in the field of microelectronic packaging. With a total of two patents to his name, he has made innovations that enhance the design and functionality of packaged microelectronic elements.

Latest Patents

His latest patents include advancements in wafer-level chip packaging and back-face and edge interconnects for lidded packages. In the wafer-level chip packaging patent, Burtzlaff details a microelectronic element that features a device region and a contact region, allowing for exposed contacts adjacent to the peripheral edges. This innovation includes support walls that enable a lid to be mounted above the microelectronic element, optimizing the design for efficiency and performance.

The second patent focuses on a packaged microelectronic device that incorporates a chip with both an upwardly-facing front surface and a downwardly-facing rear surface. This design allows unit connections, which are electrically connected to the chip, to be exposed at the top surface of the lid. Additionally, the package structure contributes to defining package terminals, which further enhance the interconnectivity and usability of the packaged device.

Career Highlights

Throughout his career, Robert Burtzlaff has worked with respected companies such as Tessera Technologies Ireland Limited and Adeia Semiconductor Bonding Technologies Inc. His experience in these organizations has contributed to his expertise in microelectronic packaging, leading to his inventive solutions.

Collaborations

In his professional journey, Burtzlaff has collaborated with talented individuals, including Giles Humpston and Michael James Nystrom. These collaborations have fostered an environment of innovation and creativity, further enhancing the development of advanced microelectronic solutions.

Conclusion

Robert Burtzlaff's contributions to the field of microelectronics through his patents illustrate his dedication to innovation. His work not only reflects his expertise but also sets a precedent for future developments in microelectronic packaging technology. As the industry continues to evolve, Burtzlaff's inventions stand as a testament to the importance of ingenuity in driving technological advancement.