The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Sep. 24, 2004
Robert Burtzlaff, Santa Clara, CA (US);
Belgacem Haba, Cupertino, CA (US);
Giles Humpston, San Jose, CA (US);
David B. Tuckerman, Orinda, CA (US);
Michael Warner, San Jose, CA (US);
Craig S. Mitchell, San Jose, CA (US);
Robert Burtzlaff, Santa Clara, CA (US);
Belgacem Haba, Cupertino, CA (US);
Giles Humpston, San Jose, CA (US);
David B. Tuckerman, Orinda, CA (US);
Michael Warner, San Jose, CA (US);
Craig S. Mitchell, San Jose, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.