Avi Dayan

Title: Avi Dayan: Innovator in Microelectronic Packaging

Introduction

Avi Dayan is a notable inventor based in Jerusalem, Israel, recognized for his contributions to the field of microelectronics. With a total of two patents to his name, Dayan has made significant advancements in the packaging of microelectronic elements.

Latest Patents

Dayan's latest patents include innovative methods for wafer-level chip packaging. This technology involves packaged microelectronic elements that feature a front face and multiple peripheral edges. The design includes a device region and a contact region with exposed contacts, allowing for enhanced functionality. Additionally, he has developed a method for wafer-level fabrication of lidded chips with an electrodeposited dielectric coating. This method is particularly useful for semiconductor elements, such as sensor units for optical imaging, ensuring that conductive features are insulated and effectively connected.

Career Highlights

Throughout his career, Avi Dayan has worked with prominent companies in the microelectronics industry, including Tessera Technologies Hungary and Tessera Technologies Ireland. His experience in these organizations has contributed to his expertise and innovative capabilities in the field.

Collaborations

Dayan has collaborated with talented professionals such as Vage Oganesian and Andrey Grinman, further enhancing his work in microelectronic innovations.

Conclusion

Avi Dayan's contributions to microelectronic packaging and fabrication methods highlight his role as a significant inventor in the industry. His patents reflect a commitment to advancing technology in microelectronics, making him a noteworthy figure in this field.