The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2014

Filed:

Jun. 05, 2012
Applicants:

Belgacem Haba, Saratoga, CA (US);

Giles Humpston, Buckinghamshire, GB;

Moti Margalit, Zichron Yaaqov, IL;

Inventors:

Belgacem Haba, Saratoga, CA (US);

Giles Humpston, Buckinghamshire, GB;

Moti Margalit, Zichron Yaaqov, IL;

Assignee:

Invensas Corp., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/441 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microelectronic unit can include a semiconductor element having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts at the front surface and a rear surface remote from the front surface. The semiconductor element can have through holes extending from the rear surface through the semiconductor element and through the contacts. A dielectric layer can line the through holes. A conductive layer may overlie the dielectric layer within the through holes. The conductive layer can conductively interconnect the contacts with unit contacts.


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