Osaka, Japan

Fumio Echigo

This inventor holds 32 USPTO granted patents and 2 published patent applications, primarily in Printed Circuit Boards. Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Corporation. Active years: 1994-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fumio Echigo. Retrieved from https://idiyas.com/inventor/fumio-echigo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 34.4

Average Co-Inventor Count = 4.3

ph-index = 8

Forward Citations = 248(Granted Patents)


Company Filing History:


Years Active: 1994-2013

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Areas of Expertise:
Multilayer Circuit Board
Printed Circuit Board
Manufacturing Process
Capacitor Sheet
Resin Board
Mask Film
Double-Sided Circuit Board
Magnetic Recording Medium
Interstitial Inner Via Hole
Connection Medium Body
32 patents (USPTO):Explore Patents

Title: Fumio Echigo: Innovator in Printed Circuit Board Technology

Introduction

Fumio Echigo, a prominent inventor based in Osaka, Japan, has made significant contributions to the field of circuit board technology. With a remarkable portfolio of 32 patents, Echigo specializes in innovations that enhance the performance and durability of printed wiring boards.

Latest Patents

Echigo's latest patents include groundbreaking innovations such as the **multilayer printed wiring board and mounting body using the same**. This invention involves a multilayer printed wiring board assembled from multiple printed wiring boards, each featuring wiring on both sides. The technology incorporates a relaxing connection layer that interconnects these boards, containing an inorganic filler and a thermosetting resin. This innovative layer effectively absorbs internal stress during the heating and cooling processes, preventing warpage and ensuring durability.

Another significant patent is the **solid printed circuit board and method of manufacturing the same**. In this invention, upper and lower printed circuit boards with varying shapes and wiring configurations are bonded together using a specially designed bonding layer. This layer, comprising insulating material infused with thermosetting resin and inorganic filler, features a via-conductor that improves the circuit board's compactness and suitability for high-performance semiconductors.

Career Highlights

Fumio Echigo has had a fruitful career, working for distinguished companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation. His work at these reputable organizations helped establish him as an authority in the field of electrical engineering and circuit board technology.

Collaborations

Throughout his career, Echigo collaborated with notable individuals in the industry, including Tadashi Nakamura and Daizo Andoh. These partnerships have contributed to the development of innovative technologies and advancements in printed circuit board design.

Conclusion

Fumio Echigo stands out as a leading inventor in the realm of printed wiring boards, with a wealth of knowledge and a track record of successful patents. His inventions not only improve the functionality of electronic devices but also ensure their reliability in various applications. As the demand for advanced circuit technology continues to grow, Echigo's contributions are likely to remain pivotal in shaping the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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