The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
Oct. 17, 2003
Shinobu Kokufu, Osaka, JP;
Takeshi Suzuki, Osaka, JP;
Fumio Echigo, Osaka, JP;
Daizo Andoh, Osaka, JP;
Tatsuo Ogawa, Atlanta, GA (US);
Yoshihiro Kawakita, Osaka, JP;
Satoru Tomekawa, Osaka, JP;
Shinobu Kokufu, Osaka, JP;
Takeshi Suzuki, Osaka, JP;
Fumio Echigo, Osaka, JP;
Daizo Andoh, Osaka, JP;
Tatsuo Ogawa, Atlanta, GA (US);
Yoshihiro Kawakita, Osaka, JP;
Satoru Tomekawa, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.