The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2006
Filed:
Sep. 14, 2005
Yasuhiro Nakatani, Kawachinagano, JP;
Hideki Higashitani, Souraku-gun, JP;
Tadashi Nakamura, Suita, JP;
Fumio Echigo, Osaka, JP;
Yasuhiro Nakatani, Kawachinagano, JP;
Hideki Higashitani, Souraku-gun, JP;
Tadashi Nakamura, Suita, JP;
Fumio Echigo, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.