The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Oct. 27, 2003
Daizo Andoh, Katano, JP;
Fumio Echigo, Osaka, JP;
Tadashi Nakamura, Suita, JP;
Yasuhiro Nakatani, Kawachinagano, JP;
Yoji Ueda, Osaka, JP;
Tousaku Nishiyama, Nara, JP;
Shozo Ochi, Takatsuki, JP;
Daizo Andoh, Katano, JP;
Fumio Echigo, Osaka, JP;
Tadashi Nakamura, Suita, JP;
Yasuhiro Nakatani, Kawachinagano, JP;
Yoji Ueda, Osaka, JP;
Tousaku Nishiyama, Nara, JP;
Shozo Ochi, Takatsuki, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.