The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2012
Filed:
May. 28, 2008
Tadashi Nakamura, Osaka, JP;
Fumio Echigo, Osaka, JP;
Takayuki Kita, Osaka, JP;
Kota Fukasawa, Yamanashi, JP;
Shogo Hirai, Osaka, JP;
Tadashi Nakamura, Osaka, JP;
Fumio Echigo, Osaka, JP;
Takayuki Kita, Osaka, JP;
Kota Fukasawa, Yamanashi, JP;
Shogo Hirai, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.