Yamanashi, Japan

Kota Fukasawa

This inventor holds 3 USPTO granted patents. Top assignee: Panasonic Corporation. Active years: 2012-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kota Fukasawa. Retrieved from https://idiyas.com/inventor/kota-fukasawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.1

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2012-2013

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Innovations of Kota Fukasawa

Introduction

Kota Fukasawa is a notable inventor based in Yamanashi, Japan. He has made significant contributions to the field of circuit board technology. With a total of 3 patents to his name, Fukasawa's work focuses on enhancing the reliability and efficiency of circuit boards.

Latest Patents

Fukasawa's latest patents include innovative designs and manufacturing methods for circuit boards. One of his patents describes a multi-layer circuit board with a cavity structure and a full-layer IVH structure. This design allows for high interlayer connection reliability by stacking an upper board, a connection sheet, and a lower board, which are heated and pressed together. Another patent details a circuit board with a connection layer featuring a fillet. This design connects sub-boards through a via-conductor, ensuring a dense and reliable connection.

Career Highlights

Kota Fukasawa is currently employed at Panasonic Corporation, where he continues to develop cutting-edge technologies in circuit board manufacturing. His work has been instrumental in advancing the capabilities of electronic devices.

Collaborations

Fukasawa collaborates with talented coworkers such as Takayuki Kita and Tadashi Nakamura. Their combined expertise contributes to the innovative projects at Panasonic Corporation.

Conclusion

Kota Fukasawa's contributions to circuit board technology exemplify the spirit of innovation. His patents reflect a commitment to improving electronic device performance and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…