The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6866892 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 15, 2005

Filed:

Jun. 27, 2003
Applicants:

Takeshi Suzuki, Osaka, JP;

Satoru Tomekawa, Osaka, JP;

Yoshihiro Kawakita, Osaka, JP;

Yasushi Nakagiri, Kyoto, JP;

Fumio Echigo, Osaka, JP;

Inventors:

Takeshi Suzuki, Osaka, JP;

Satoru Tomekawa, Osaka, JP;

Yoshihiro Kawakita, Osaka, JP;

Yasushi Nakagiri, Kyoto, JP;

Fumio Echigo, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D003/12 ;
U.S. Cl.
CPC ...
Abstract

A compression function layeris provided on at least one board surface. The compression function layeradds a function of being compressed by receiving pressure in the direction of the board thickness to the resin boardwhich includes this layer. Thereby a sufficient pressure is applied to conductors


Find Patent Forward Citations

Suzuki, Takeshi. (2005). Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board (U.S. Patent No. 6866892). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6866892

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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