Dresden, Germany

Frank G Kuechenmeister

USPTO Granted Patents = 38 

 

Average Co-Inventor Count = 3.3

ph-index = 6

Forward Citations = 121(Granted Patents)


Location History:

  • Dresden, DE (US) (2012)
  • Dresden, DE (2003 - 2024)

Company Filing History:


Years Active: 2003-2025

where 'Filed Patents' based on already Granted Patents

38 patents (USPTO):

Title: Innovations of Frank G. Kuechenmeister in Chip Module Design

Introduction

Frank G. Kuechenmeister, based in Dresden, Germany, is a prominent inventor known for his significant contributions in the realm of chip module design. With a remarkable portfolio of 37 patents, Kuechenmeister has consistently pushed the boundaries of technology, particularly in the field of radio frequency integrated circuits (RFIC).

Latest Patents

Among his latest innovations are two noteworthy patents:

1. **Chip Module Structure and Method and System for Chip Module Design Using Chip-Package Co-Optimization**: This invention outlines a chip module that combines an RFIC chip with a package. The design approach splits the RF front end between the chip and the package, optimizing the performance through complex power matching techniques. This innovation not only enhances peak power transfer across a broader bandwidth but also enables size scaling of devices by reducing power requirements. The iterative chip-package co-optimization process is central to achieving these improvements.

2. **Crackstop with Embedded Passive Radio Frequency Noise Suppressor and Method**: This patent provides a solution for minimizing local signal interference through the integration of noise suppressors within a specialized crackstop surrounding the IC area. The embedded metallic barriers, which can be customized according to customer-specified operating parameters, help to inhibit noise propagation and protect the IC from moisture ingress.

Career Highlights

Kuechenmeister has held key positions at notable companies in the semiconductor industry, including Advanced Micro Devices Corporation and Globalfoundries Inc. His work has significantly impacted the development of advanced RFIC technologies and design methodologies.

Collaborations

Throughout his career, Kuechenmeister has collaborated with esteemed colleagues such as Matthias Lehr and Gotthard Jungnickel. These partnerships have fueled innovation and led to breakthroughs in chip design and performance optimization.

Conclusion

Frank G. Kuechenmeister's impressive body of work and numerous patents demonstrate his dedication to advancing technology in the field of semiconductor design. His innovative approaches, particularly in chip-module co-optimization and noise suppression, exemplify the importance of continuous innovation in driving the electronics industry forward.

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