The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Jun. 25, 2012
Michael Z. Su, Round Rock, TX (US);
Lei Fu, Austin, TX (US);
Frank Kuechenmeister, Dresden, DE;
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
Integrated circuit packages comprise vias, each of which extends from a pad in communication with an integrated circuit on a semiconductor chip through insulating material overlying the semiconductor chip to an attachment surface facing a substrate. The portion of each via proximate the attachment surface is laterally offset from the portion proximate the pad from which it extends in a direction away from the center of the semiconductor chip. Metallic material received in the vias mechanically and electrically interconnects the semiconductor chip to the substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile