The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Dec. 08, 2020
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventors:
Assignee:
GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/78 (2013.01);
Abstract
The present disclosure relates to semiconductor structures, and more particularly, to crackstop structures and methods of manufacture. The structure includes: a die matrix comprising a plurality of dies separated by at least one scribe lane; and a crackstop structure comprising at least one line within the at least one scribe lane between adjacent dies of the plurality of dies.
Rajoo, Ranjan. (2023). Crackstop structures (U.S. Patent No. 11652069). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11652069
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile