The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Jul. 20, 2011
Michael Grillberger, Radebeul, DE;
Matthias Lehr, Dresden, DE;
Frank Kuechenmeister, Dresden, DE;
Steffen Koch, Bretnig-Hauswalde, DE;
Michael Grillberger, Radebeul, DE;
Matthias Lehr, Dresden, DE;
Frank Kuechenmeister, Dresden, DE;
Steffen Koch, Bretnig-Hauswalde, DE;
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Abstract
In a semiconductor device or test structure, appropriate heating elements, for instance in the form of resistive structures, are implemented so as to obtain superior area coverage, thereby enabling a precise evaluation of the thermal conditions within a complex semiconductor device. In particular, the device internal heating elements may allow the evaluation of hot spots and the response of a complex metallization system to specific temperature profiles, in particular at critical areas, such as edge regions in which mechanical stress forces are typically highest in contact regimes in which the package substrate and the metallization system are directly connected.